2nd Gen Intel® Core™ Processor Family: Thermal Design Guide
The power needs of electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over the product’s life cycle, the heat generated by the device must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.
The goals of this document are to:
• Specify the thermal and mechanical specification for the device.
• Describe a reference thermal solution that meets the specifications.
Read the full 2nd Gen Intel® Core™ Processor Family Thermal Design Guide.
NCR on how 3rd gen Intel® Core™ processor-based transaction retail solutions support their innovation strategy.
GE increases Intel® Core™ processor use, enabling industrial control and rugged deployments.
Overview: Highlights the benefits and enhancements of the platform. (v.001, May 2011)
Video: Console set up and firmware upgrade on Intel® Gateway Solutions for the IoT with Intel® Quark™ SoC X1000 (v.1.1.13, May 2014)
Video: Wind River IDP application integration on Intel® Gateway Solutions for the IoT with Intel® Quark™ SoC X1000 (v.2.1.11, May 2014)
Video: Wind River IDP with McAfee* Embedded Control (MEC) on Intel® Gateway Solutions for the IoT with Intel® Quark™ SoC X1000 (v.2.2.11, Jun. 2014)