Fab 17 ISO 9001:2008
Certifies that Intel Corporation—Fab 17 in Hudson, Massachusetts, complies with the ISO 9001:2008 requirements of wafer fabrication, associated equipment, and processes.
Read the full Fab 17 ISO 9001:2008 Certification.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Intel’s ESD prevention methods prevent costly damage to electronic devices.
Processor insertion guide for LGA115X socket independent loading mechanism, minimizing contact damage.
Step-by-step instructions for aligning Intel® motherboards and the I/O opening on a computer chassis.