Shows how to attach Kyowa strain gage to Intel® Ball Grid Array packages; measures board flexure.
PoP device rework demos thermal reflow profile, PCB pad site, and new component preparation.
Guide to LGA115X socket independent loading mechanism installation, minimizing contact damage.
Demos antenna and oscilloscope use for ESD detection, minimum tool requirements, and parameter setup.
Reviews corner glue use, material selection criteria, and demos proper application techniques.
Shows how to attach Vishay strain gage to Intel® Ball Grid Array packages; measures board flexure.